Multilayer Rigid PCB & HDI PCB Factory

Standard rigid PCBs use through-hole vias connecting all layers, typically with larger trace widths (4mil+). HDI (High Density Interconnect) PCBs use microvias, blind/buried vias, and sequential lamination to achieve higher routing density. HDI allows for smaller pad sizes, finer traces (3mil/3mil), and enables complex designs like 1+N+1, 2+N+2, or Any Layer interconnection structures essential for smartphones and advanced automotive electronics.

Impedance control ensures signal integrity for high-speed digital and RF circuits by maintaining consistent characteristic impedance (typically 50Ω, 90Ω, or 100Ω). We offer ±5% impedance tolerance for critical applications and ±10% for standard designs. Every panel includes impedance test coupons, and we provide TDR (Time Domain Reflectometry) reports upon request. Our advanced capability supports controlled dielectric thickness and specific stack-up requirements.

Beyond standard FR4 (TG135-150), we offer High TG materials (170°C/180°C) for lead-free soldering, Rogers and Isola laminates for RF/high-frequency applications, and Polyimide for extreme temperature environments. For HDI applications, we use low-Dk, low-Df materials to minimize signal loss. All materials are UL approved and suitable for automotive (IATF 16949) and medical (ISO 13485) applications.

Standard 2-4 layer rigid PCB prototypes ship in 2-6 days. 6-8 layer boards require 5-7 days, while 10+ layer or HDI structures (1+N+1) typically take 7-10 days due to sequential lamination cycles. We offer 24-48 hour expedited services for urgent automotive and telecommunications projects. Lead times include electrical testing (100% E-test) and final inspection.